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Surface Mount Terminal Blocks

930-THR (-DS) 3.50 mm (0.138 in) Spacing   -   2-12 poles Print this page

  • Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and better air flow during the reflow soldering process. Material will handle reflow temperatures well without deforming or melting.
  • Through Hole Reflow
  • Wire entrance parallel to PC Board
Technical Data

Center to Center Spacing: 3.500 mm (0.138 in)

Nominal Cross Section: 1 mm2 (1550 mils2)

Wire Stripping Length: 6.000 mm (0.236 in)

Recommended Hole Diameter in PC Board: 1.300 mm (0.051 in)

Bill of Materials

Terminal Body: Tin plated copper alloy

: Nickel silver

Screw: Slotted head, zinc plated blue passivated, steel substrate M2

Solder Pin: Tin plated copper alloy Ø 0.9 mm (0.035 in.)

Average weight per pole: 0.5 g



WECO's THR designs are adapted for easy integration into your processes. Standoffs provide for;od convective heat circulation for reliable soldering through the elimination of cold spots and also allow for a visual inspection of the solder joints. The main advantage of through-hole terminal blocks is their reliable mechanical strength. This robustness is particularly important for applications exposed to harsh environments or strong vibrations such as mobile equipment, engine or motor compartments.

Visual Description
  • RoHS WEEE Pb free surface compliant
Approval Information UL File No. E69841  |  CSA File No. LR24322
    TYPE (Spacing)
    Current (A)
    Voltage (V)
    Screw Tightening
  • 930-THR (-DS)
    3.5 mm
     2.0 lbfin 
  • 930-THR (-DS)
    3.5 mm
     0.2 Nm 
Please fill in the How to Order box
Wire protector:
Plated component: terminal body
Ordering Notes
See download PDF for complete tape and reel assembly specifications








WECO do Brasil Ltda.
BR 116, 12757 Vila Fanny CEP: 81.690-200
Curitiba - PR - Brasil
Tel: +55 41 3278-9720