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SMarTconn - Brand History

At the end of the 20th century, the printed circuit board manufacturing environment experienced an evolution of soldering technology of passive and active components: the shift from the through-hole wave solder process to the through-hole reflow process.  Unlike wave soldering, the reflow process allows through-hole or PCB surface mounted components to be soldered without the need for wave but simply conveying the populated boards through a re-flow oven as per a certain temperature cycling process.

Thanks to the utilization of the surface mount technology (SMT) the cost of the PCB assembly processing drastically decreased and the PCB real estate usage of the components increased because of the utilization of both sides of the PCB surface.
One major advantage of the utilization of the SMT assembly method is the elimination of many quality issues related to the problems caused by the wave solder process. One typical example is the improvement of solder inconsistency resulting from the introduction of the SMT assembly method.

At the connector design level, the technological migration from Wave Solder towards SMT could not be followed at the same pace. Interconnect products had to maintain considerably larger dimensions, compared to the majority of other passive or active electronic components. Three major assembly and reliability issues intimately depend on the size, mass and volume of a component:

• Retention technique to the PCB surface
• Coefficient of Thermal Expansion (CTE) mismatch
• Co-planarity of electrical contacts to PCB surface

  Co-Planar adaptable connector integrated in our
120-M-221-SMD header fully  eliminates CTE mismatch

To meet the challenge of successfully transforming through-hole to genuine SMT, the above issues had to be solved via patented inventions.
The 'floating pin’ concept ensures total co-planarity adaptation to the PCB surface and fully eliminates CTE mismatch effect.

Our anchoring method, as seen in our connector 140-A-126-SMD, is performed via a position adaptable anchor included into the lateral flanges of the plastic housing.  This ensures an extremely high retention force to the PCB surface after the soldering process: connectors are fully protected against "peel-off" stress from abusive wire pulling during installation.

Today, WECO is the industry leader in providing a broad panel of terminal blocks, pinstrips and headers for the continuously growing SMT industry. SMarTconn products are engineered to meet the reflow process constraints using high temperature resistant materials that ensure proper solder of electrical contacts to the PCB circuits.

SMarTconn offers two categories of surface mount products: genuine (no holes required in the printed circuit board) and through-hole reflow (solder reflow process designed for PCB with holes).

All SMarTconn products are UL and CSA approved and use heat resistant, self-extinguishing thermoplastic materials compliant to RoHS regulations. SMarTconn products are designed for use in automated assembly environments: equipped with pick caps and supplied in transfer tubes or on carrier tape for use with feeders and dispensers for automated pick and place machinery.

SMarTconn is a trademark of WECO Electrical Connectors Inc. and is the industry leader in providing surface mount connectors designed to customers’ specifications. SMarTconn products are engineered to meet your dimensional, material, mounting, packaging, reliability and cost savings production requirements.
WECO do Brasil Ltda.
BR 116, 12757 Vila Fanny CEP: 81.690-200
Curitiba - PR - Brasil
Tel: +55 41 3278-9720